// Placement

Smallest component

01005 (0402 metric)

Largest component

100 × 100 mm, height ≤ 25.4 mm

Chip accuracy

±50 µm

IC accuracy

±30 µm

BGA range

0.15 mm ball → 100 × 100 mm

// Board handling

Minimum PCB

48 × 48 mm

Maximum PCB

510 × 510 mm

Board Thickness

0.1mm-6mm supported

Fabrication

HDI to 60 layers, rigid-flex, metal-core, Hybrid Material

// Line equipment

SMT lines

2 × Fuji Aimex IIIC (automated)

Inspection

Koh Young 3D Zenith Alpha HS+ 3D AOI & SPI

Reflow

Nitrogen-capable oven

Feeder capacity

444 feeders + 10 tray positions

// Test & finish

Inspection

X-ray, 3D AOI, FAI

Test

Functional, burn-in, environmental

Rework

BGA rework & re-balling

Coating

Automated Conformal Coating

// Our manufacturing & service capabilities

• PCB Manufacturing
• Components Procurement
• PCB Assembly
• Quality Inspection
• System Integration
• Engineering & NPI Support

// Capability overview

PCB technology

Rigid · HDI · Flex · Rigid-Flex

Electronics assembly

SMT · Through-Hole · Mixed Technology

Fine-pitch capability

Fine-Pitch · BGA / Micro-BGA · High-Density PCBA

Procurement

Component Procurement · PCB Procurement

Supply models

Full / Partial Turnkey · Customer-Supplied Material

Special processes

Alternate Sourcing · Global Supply Chain · Selective / Wave Soldering

Finishing and testing

BGA Rework · Replacement · Re-Balling · Conformal Coating · Thermal / Environmental Testing

// Advanced PCB manufacturing

PCB technologies

Rigid PCB · HDI PCB · Flex PCB · Rigid-Flex PCB

Advanced structures

Blind · Buried · Stacked Vias

Interconnect

High-Density Interconnect · Fine-Line / Fine-Pitch

Signal integrity

Controlled Impedance

Material capability

Standard FR-4 · High-Speed / Low-Loss Materials

Advanced materials

Ultra-Low-Loss Materials · Application-Specific Selection

Production scope

Prototype → NPI → Volume Production

// PCB procurement support & DFM engineering

• PCB Sourcing
• Fabrication Partner Management
• Technical Specification Review
• Material Selection
• DFM-Oriented PCB Evaluation
• DFM Analysis
• Design for Assembly
• BOM Review
• Layer Stack-Up Guidance
• Impedance Verification

// Component & PCB procurement

Component sourcing

Active · Passive · Electromechanical Components

Additional sourcing

Connectors & Modules · Special / Application-Specific Components

Alternate sourcing

Alternate Component Sourcing

Procurement models

Full Turnkey Supply · Partial Turnkey Supply

Customer supply

Customer-Supplied Components

Procurement control

BOM Management & Review · Component Availability Analysis

Supplier sourcing

Manufacturer / Distributor Sourcing

// Supply chain services

• Global Supplier Network
• Procurement Coordination
• Incoming Material Verification
• Component Traceability
• Controlled Kitting
• Reel / Material Verification

// Precision SMT & advanced assembly

Assembly capability

High-Speed Automated SMT

Production mix

High-Mix / Low-to-Medium Volume

Production stages

Prototype · NPI & Production

Component capability

Fine-Pitch · High-Density PCBA · QFN / Bottom-Terminated

BGA capability

BGA & Micro-BGA · 0.15 mm Pitch

BGA services

Replacement · Re-Balling

Placement capacity

200K CPH combined capacity

Smallest component

01005

Industry-leading automated SMT placement with 200K CPH combined capacity. Fine-pitch and high-density PCBA with full BGA capability down to 0.15 mm pitch.

End-to-end process control: 3D Solder Paste Inspection, controlled reflow profiling, 3D AOI, and X-Ray inspection for complete assembly quality assurance.

// Through-hole, mixed technology & special processes

Comprehensive assembly and process capabilities spanning conventional through-hole, mixed SMT+PTH, advanced soldering technologies, and specialised surface protection processes.

• Conventional Through-Hole Assembly
• Large Through-Hole Components
• Connector-Based Assemblies
• Mixed SMT + PTH Assemblies
• Process Inspection & Visual Verification
• Selective Wave Soldering
• Conventional Wave Soldering
• Manual Soldering & Touch-Up
• Rework & Repair Support
• Controlled Process Parameters
• Selective Coating Application
• Coating Thickness Control
• Thermal / Environmental Stress Testing
• Temperature Cycling
• Reliability Verification

// Inspection & quality control

3D SPI

Paste volume, paste height & process verification

3D AOI

Component presence, placement accuracy, solder defects, missing / misaligned components

Inspection coverage

100% Inline 3D SPI & AOI inspection at every stage

X-Ray inspection

Shimadzu X-Ray system for BGA & hidden solder-joint inspection

Assembly analysis

QFN / bottom-terminated components, void detection, open / bridge detection & internal assembly analysis

Final inspection

Visual inspection & final quality verification

Documentation

Lot traceability & full process documentation

Process & final inspection at every production stage.

// Box build & system integration

PCBA integration

PCB Assembly Integration · Sub-Assembly Integration · Board-to-Board / Module Integration

Mechanical integration

Enclosure Assembly · Mechanical Sub-Assemblies · Component & Hardware Integration

Final assembly

System-Level Assembly · Wiring / Interconnect Integration

Completion support

Labeling / Identification · Final Inspection & Pack-Out Support

Production flow

PCBA → Sub-Assembly → Integration → Final Product

From board-level assembly through enclosure build and system integration — complete box build capability under one roof.

// Engineering & NPI services

Design data & review

DFM / DFA / DFT Analysis · BOM Engineering & Review · Technical Specification Review

Component engineering

Component Selection & Validation · Alternate Component Recommendations

Optimization

Cost Analysis & Optimization

Prototype & NPI

Prototype Build & Validation · Process Development & Refinement

NPI readiness

NPI Readiness Assessment · Process Optimization · First Article Inspection

Validation cycle

Build-Validate-Refine Cycle

Production readiness

Controlled Manufacturing Transition · Process Documentation & Control

Traceability & quality

BOM & Component Traceability · Quality Plan Implementation

Scale

Scalable Volume Production · Continuous Process Improvement