Most products pass through four hands before they ship. Ours pass through one roof — which is why they ship on time.
Expert CAD,CAM engineers translate your schematics into manufacturable reality — PCB layout, stackup design and material selection, DFM/DFA review, and electromechanical design that anticipates the production line instead of fighting it.
Prototype to production runs of rigid, rigid-flex, metal-core and HDI boards — up to 60 layers — backed by first-article inspection on every new part number.
Two automated Fuji Aimex III SMT lines place components from 01005 chips to 100 mm BGAs at 30-micron accuracy, with SPI 3D optical inspection, 3D-X-ray, and nitrogen reflow.
Complete product integration — enclosures, cable harnesses, firmware loading, functional and environmental test, and packaging. Your product arrives ready to sell.
