HDI PCB

DescriptionProductionAdvanced
Structure3+n+3 (9+N+9 MAX)10+N+10
Layer Count2~42L50L
Min. Board thickness0.005″ (+/-10%)0.005″ (+/-10%)
Max. Board thickness0.250″ (+/-10%)0.280″ (+/-8%)
BGA Pitch10mils (0.25mm)7mils (0.175mm)
Min.BGA pad/space7mils/3mils5mils/2mils

Materials for build up

DescriptionProductionAdvanced
Prepreg (FR4 1067/1086/2113)YesYes
Prepreg (ceramics Ro4350)YesYes
Laser Drillable PrepregYesYes
laser Drillable core (FR4, PI, PTFE, ceramics)YesYes
laser Drillable Min.Dielectric thickness1.5mils1.5mils
laser Drillable Max.Dielectric thickness5mils6mils

Laser via

DescriptionProductionAdvanced
Min / Max2.5mils / 6mils2mils / 6mils
Min via edge to via edge space6mils4mils
True position Tolerance+/-1mils+/-1mils

Drilling

DescriptionProductionAdvanced
Min. Drilled blind via diameter (as drilled)10mils8mils
Min via edge to via edge space (as drilled)8mils6mils

PTH Design

DescriptionProductionAdvanced
Blind via aspect ratio (dielectric thickness/ Laser drill hole size)0.81
Blind via plating thickness0.3~1mils0.3~1mils
Capture pad A/R2mils1.5mils
Laser via Fill MaterialEpoxy resin/Copper pasteEpoxy resin/Copper paste
Blind via aspect ratio (as drilled) (dielectric thickness/ drilling hole size)0.50.5
Blind via plating thickness (as drilled)0.5mils0.8mils
Capture pad A/R (as drilled)4mils3mils

GET IN TOUCH

Flashline EMS is aninnovativeAI driven electronics manufacturing service (EMS) partner to leading OEMs, offering high-quality design, prototype, and full-scale production for anysorts of complex printed circuit boards assemblies. Flashline EMS has years of experience in the industry, resulting in vast expertise in printed circuit board manufacturing, assembly and Box build.

Flashline EMS is over 100,000 square feet state of art, brand new manufacturing facility with capacity to grow over 10 SMT lines aimed to serve prototype to high-mix volume for the customers globally.


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