Blind via aspect ratio (dielectric thickness/ Laser drill hole size)
0.8
1
Blind via plating thickness
0.3~1mils
0.3~1mils
Capture pad A/R
2mils
1.5mils
Laser via Fill Material
Epoxy resin/Copper paste
Epoxy resin/Copper paste
Blind via aspect ratio (as drilled) (dielectric thickness/ drilling hole size)
0.5
0.5
Blind via plating thickness (as drilled)
0.5mils
0.8mils
Capture pad A/R (as drilled)
4mils
3mils
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Flashline EMS is aninnovativeAI driven electronics manufacturing service (EMS) partner to leading OEMs, offering high-quality design, prototype, and full-scale production for anysorts of complex printed circuit boards assemblies. Flashline EMS has years of experience in the industry, resulting in vast expertise in printed circuit board manufacturing, assembly and Box build.
Flashline EMS is over 100,000 square feet state of art, brand new manufacturing facility with capacity to grow over 10 SMT lines aimed to serve prototype to high-mix volume for the customers globally.
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