Rigid PCB

Inner Layer

Description

Production

Advanced

Min.Trace/Space

2mils / 2mils

1.5mils/1.5mils

Min. Copper Thickness

1/3oz

1/7 oz

Max. Copper Thickness

6oz

10oz

Min. Core Thickness

2mils

1.5mils

Line/ pad to drill hole

6mils

4mils

Line/ pad to board edge

8mils

6mils

Line Tolerance

+/-10%

+/-8%

Board Dimensions

Description

Production

Advanced

Max. Finish Board Size

19″X24″

20″X27″

min. Finish Board Size

0.2″x0.2″

0.15″*0.15″

Max. Board Thickness

0.260″(+/-10%)

0.280″(+/-8%)

Min. Board Thickness

0.007″(+/-10%)

0.005″(+/-10%)

Lamination

Description

Production

Advanced

Layer Count

50L

60L

Layer to Layer Registration

+/-4mils

+/-2mils

Drilling

Description

Production

Advanced

Min. Drill Size

6mils

5mils

Min. Hole to Hole Pitch

18mils(0.45mm)

14mils(0.35mm)

True position Tolerance

+/-3mils

+/-2mils

Slot Diameter Tolerance

+/-3mils

+/-2mils

Min gap from PTH to track inner layers

5mils

4mils

Min. PTH edge to PTH edge space

10mils

8mils

Plating

Description

Production

Advanced

Max. Aspect Ratio

30:1

35:1

Cu Thickness in Through hole

0.8-1.5 mils

2 oz

Plated hole size tolerance

+/-2mils

+/-1.5mils

NPTH hole tolerance

+/-2mils

+/-1mils

Min. Via in pad Fill hole size

6mils

4mils

Via in pad Fill Material

Epoxy resin/Copper paste

Epoxy resin/Copper paste

Outer Layer

Description

Production

Advanced

Min. Trace/Space

2.5mils / 2.5mils

2mils / 2mils

Min. pad over drill size

6mils

4mils

Max. Copper thickness

10 oz

16 oz

Line/ pad to board edge

8mils

6mils

Line Tolerance

+/-15%

+/-8%

Metal Finish

Description

Production

Advanced

HASL

50-1000u”

50-1000u”

HASL+Selective Hard gold

Yes

Yes

OSP

8-20u”

8-20u”

Selective ENIG+OSP

Yes

Yes

ENIG(Nickel/Gold)

80-200u”/2-9 u”

250u”/ 10u”

Immersion Silver

6-18u”

6-18u”

Hard Gold for Tab

10-80u”

10-80u”

Immersion Tin

30u”min.

30u” min.

ENEPIG (Ni/Pd/Au)

125u”/4u”/1u” min.

150u”/8u”/2u” min.

Soft Gold (Nickel/ Gold)

200u”/ 20u”min.

200u”/ 20u”

Solder Mask

Description

Production

Advanced

S/M Thickness

0.4mils min.

2mils max.

Solder dam width

4mils

3mils

S/M registration tolerance

+/-1.5mils

+/-1mils

S/M over line

3.5mils

2mils / 2mils

Legend

Description

Production

Advanced

Min. Space to SMD pad

6mils

4mils

Min. Stroke Width

6mils

5mils

Min. Space to Copper pad

6mils

4mils

Standard Color

White or Yellow

N/A

Electrical Testing

Description

Production

Advanced

Max. Test Points

30000 Points

30000 Points

Smallest SMT Pitch

18mils(0.45mm)

12mils(0.3mm)

Smallest BGA Pitch

12mils(0.3mm)

6mils(0.15mm)

NC Rout

Description

Production

Advanced

Min. Rout to copper space

8mils

4mils

Rout tolerance

+/-4mils

+/-3mils

Scoring (V-cut)

Description

Production

Advanced

Conductor to center line

15mils

15mils

X&Y Position Tolerance

+/-4mils

+/-3mils

Score Anger

30o/45o

30o/45o

Score Web

10mils min.

8mils min.

Beveling

Description

Production

Advanced

bevel anger

20-71o

20-71o

Bevel Dimensional Tolerance

+/-10mils

+/-10mils

Impedance controll

Description

Production

Advanced

Impedance controll

 

GET IN TOUCH

Flashline EMS is aninnovativeAI driven electronics manufacturing service (EMS) partner to leading OEMs, offering high-quality design, prototype, and full-scale production for anysorts of complex printed circuit boards assemblies. Flashline EMS has years of experience in the industry, resulting in vast expertise in printed circuit board manufacturing, assembly and Box build.

Flashline EMS is over 100,000 square feet state of art, brand new manufacturing facility with capacity to grow over 10 SMT lines aimed to serve prototype to high-mix volume for the customers globally.


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