Rigid Flex PCB

Board Dimensions

Description

Production

Advanced

Max. Finish Board Size

16″X20″

18″X26″

min. Finish Board Size

0.2″x0.2″

0.15″*0.15″

Max. Board Thickness

0.250″(+/-10%)

0.280″(+/-8%)

Min. Board Thickness

0.016″(+/-10%) For 4L

0.016″(+/-10%) For 4L

Lamination

Description

Production

Advanced

Layer Count

4~42L

50L

Layer to Layer Registration

+/-4mils

+/-3mils

Drilling

Description

Production

Advanced

Min. Drill Size

6mils

5mils

Min. Hole to Hole Pitch

20mils(0.5mm)

18mils(0.45mm)

True position Tolerance

+/-3mils

+/-2mils

Slot Diameter Tolerance

+/-3mils

+/-2mils

Min gap from PTH to track inner layers

6mils

4mils

Min gap from PTH to the border of rigid flex

30mils

20mils

Min. PTH Hole edge to PTH Hole edge space

10mils

8mils

Plating

Description

Production

Advanced

Max. Aspect Ratio

6:1

8:1

Cu Thickness in Through hole

>1mils

>1mils

Plated hole size tolerance

+/-2mils

+/-1.5mils

NPTH hole tolerance

+/-2mils

+/-1mils

Via in pad Fill Material

Epoxy resin/Copper paste

Epoxy resin/Copper paste

Layer

Description

Production

Advanced

Min. Trace/Space

3mils / 3mils

2.5mils / 2.5mils

Min. pad over drill size

6mils

4mils

Max. Copper thickness

1~2 oz

3 oz

Line/ pad to board edge

6mils

4mils

Min gap from Copper to the border of rigid flex

15mils

10mils

Line Tolerance

+/-20%

+/-10%

Metal Finish

Description

Production

Advanced

HASL

50-1000u”

50-1000u”

HASL+Selective Hard gold

Yes

Yes

OSP

8-20u”

8-20u”

Selective ENIG+OSP

Yes

Yes

ENIG(Nickel/Gold)

80-200u”/2-9 u”

250u”/ 10u”

Immersion Silver

6-18u”

6-18u”

Hard Gold for Tab

10-80u”

10-80u”

Immersion Tin

30u”min.

30u” min.

ENEPIG (Ni/Pd/Au)

125u”/4u”/1u” min.

150u”/8u”/2u” min.

Soft Gold (Nickel/ Gold)

200u”/ 20u”min.

200u”/ 20u”

Coverlay

Description

Production

Advanced

Thickness(Min) (PI / ADH)

0.5mils / 1mils

0.5mils / 1mils

dam width

20mils

15mils

registration tolerance

+/-15mils

+/-10mils

Solder Mask

Description

Production

Advanced

S/M Thickness

0.4mils min.

3mils max.

Solder dam width

4mils

3mils

S/M registration tolerance

+/-2.5mils

+/-2mils

S/M over line

3.5mils

2mils

Legend

Description

Production

Advanced

Min. Space to SMD pad

6mils

4mils

Min. Stroke Width

6mils

5mils

Min. Space to Copper pad

6mils

4mils

Standard Color

White or Yellow

N/A

Electrical Testing

Description

Production

Advanced

Max. Test Points

30000 Points

30000 Points

Smallest SMT Pitch

20mils

16mils

Smallest BGA Pitch

20mils

16mils

Laser Rout (LPKF)

Description

Production

Advanced

Min. Rout to copper space

6mils

4mils

Rout tolerance

+/-2mils

+/-2mils

NC Rout

Description

Production

Advanced

Min. Rout to copper space

8mils

4mils

Rout tolerance

+/-4mils

+/-3mils

Impedance controll

Description

Production

Advanced

Impedance controll

+/-8%

+/-5%

EMI

Description

Production

Advanced

PC-5500&PC-5600

Yes

Yes

Stiffener

Description

Production

Advanced

PI

Yes

Yes

FR4

Yes

Yes

Metal

Yes

Yes

Conductive & thermal adhesive

Description

Production

Advanced

3M Type

Yes

Yes

Eccobond

Description

Production

Advanced

Eccobond over Flex width

60mils

60mils

GET IN TOUCH

Flashline EMS is aninnovativeAI driven electronics manufacturing service (EMS) partner to leading OEMs, offering high-quality design, prototype, and full-scale production for anysorts of complex printed circuit boards assemblies. Flashline EMS has years of experience in the industry, resulting in vast expertise in printed circuit board manufacturing, assembly and Box build.

Flashline EMS is over 100,000 square feet state of art, brand new manufacturing facility with capacity to grow over 10 SMT lines aimed to serve prototype to high-mix volume for the customers globally.


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